Thermosonic Flip Chip Interconnection Using Electroplated Copper Column Arrays

3-d Analysis of a Copper Flip-chip Interconnection Using Fib-sem Slice and View

Recently, flip-chip assembly has become mainstream for fine-pitch interconnection in large-scale integration packages. Gold studs and copper pillars with solder caps are two types of bumps in common use.[1] Gold stud bumps are commonly used for interconnecting dice with peripheral layouts. Gold-gold bonding has the advantage of a low process temperature, and gold-solder with adhesive has good w...

Electromigration Characteristic of SnAg3.0Cu0.5 Flip Chip Interconnection

1 Ph.D. Candidate 2 Corresponding Author, Professor Abstract Electromigration is a reliability concern of microelectronic interconnections, especially for flip chip solder bump with high current density applied. This study shows that with the line-to-bump geometry in a flip chip solder joint, the current density changes significantly between the Al trace and the bump, while the current crowding...

Thermosonic Flip Chip Bonding System with a Self-Planarization Feature Using Polymer

Thermosonic flip-chip bonding is a wire bonding technology modified for flip-chip assembly. Compared with the soldering technology, it is simpler, faster and more costeffective. Unfortunately, the yield of thermosonic bonding is low and unreliable because it is difficult to control the ultrasonic energy transmission. A small planarity angle between the bonding tool and stage can result in a non...

All-copper Chip-to-substrate Interconnections for Flip-chip Packages

Flip chip electrical interconnection by selective electroplating and bonding

This work presents a parallel electrical interconnection process by means of flip-chip, selective electroplating and bonding. The electrical interconnection lines are built on a glass substrate made of 500/2000 Å of Cr/Au with 3150 lm in length and 10 lm in width. Two silicon chips are processed as the device chips to be electrically interconnected. It has been demonstrated that 98 out of 102 i...